You want the IPC-7351C PDF to copy a footprint.
Unlike through-hole components, SMT components rely entirely on the copper pattern on the PCB for mechanical strength and electrical connectivity. The IPC-7351C standard provides three density levels for land patterns to accommodate different manufacturing capabilities: ipc-7351c pdf
: Recommending corner radii for pads instead of traditional oblong shapes to improve solder joint quality. You want the IPC-7351C PDF to copy a footprint
IPC‑7351C, "Generic Requirements for Surface Mount Design and Land Pattern Standard," is the industry standard that defines land pattern (footprint) geometry and design rules for surface‑mount components on printed circuit boards (PCBs). The standard provides recommended pad sizes, component land pattern variations (least, nominal, most), and design considerations to ensure manufacturability and reliable solder joints. component land pattern variations (least